Intel CEO Pat Gelsinger took to video to outline his IDM (Integrated Device Manufacturing) 2.0 Vision during the company’s global “Intel Unleashed: Engineering the Future” webcast. Video is much safer than a Press conference or an interview as you don't have to face any questions or substantiate the claims that you make. 00:00 Start 00:15 Introduction 01:00 Tock is cheap 03:34 IDM 2.0 04:47 Process innovation??? 05:09 Intels leadership in packaging technology 05:37 Expanded use of third party foundry capacity 06:30 Building a world class foundry business 07:08 Accelerating Intels IDM 2.0 strategy 07:36 Official quotes from Gelsinger 09:19 Intel’s 7nm Progress 10:27 Some notes 11:19 Product Roadmap update 12:48 Ponte Vecchio gets exposed 13:22 Leo ‘prove it to us Intel, I have no faith you can deliver’ NEWS HIGHLIGHTS Announcing manufacturing expansion plans; beginning with $20 billion investment to build two new fabs in Arizona Intel 7 nanometer process development progressing well with tape in of 7nm compute tile for “Meteor Lake” expected in the second quarter of 2021 Announcing Intel Foundry Services with plans to become a major provider of foundry capacity in the U.S. and Europe to serve customers globally Announcing plans for new research collaboration with IBM Bringing the spirit of Intel Developer Forum event back this year with Intel Innovation event planned for October in San Francisco IDM 2.0 represents the combination of three components that will enable the company to drive sustained technology and product leadership: Today, Gelsinger re-affirmed the company’s expectation to continue manufacturing the majority of its products internally. The company’s 7nm development is progressing well, driven by increased use of extreme ultraviolet lithography (EUV) in a rearchitected, simplified process flow. Intel expects to tape in the compute tile for its first 7nm client CPU (code-named “Meteor Lake”) in the second quarter of this year. "In addition to process innovation" - say what? Intel’s leadership in packaging technology is an important differentiator that enables the combination of multiple IPs or “tiles” to deliver uniquely tailored products that meet diverse customer requirements in a world of pervasive computing. So that's tiles rather than chiplets. Expanded use of third-party foundry capacity. Intel expects to build on its existing relationships with third-party foundries, which today manufacture a range of Intel technology – from communications and connectivity to graphics and chipsets. Gelsinger said he expects Intel’s engagement with third-party foundries to grow and to include manufacturing for a range of modular tiles on advanced process technologies, including products at the core ... https://www.youtube.com/watch?v=Lqs0oCKMt2s